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New reports suggest that Qualcomm is all set to launch its next-generation processor-Snapdragon 845 much sooner than expected.

 Weibo that show leaked poster of a Qualcomm event are now suggesting that the phone could be launched as early as December 2017, says a report in Gizmochina.

A poster from a Snapdragon event has apparently been leaked which suggests a "Snapdragon Technology Summit” from December 4 to 8, where it is expected to announce a next-generation processor.

The alleged leaked poster of the Qualcomm event (Courtesy: Weibo)

Also Read: Here's how the world's first 5G smartphone looks like

Even though the leaked reports suggest a way earlier launch than expected, "arriving” might be an overstatement as the chipset is highly unlikely to go into mass production till the end of 2018, or even early 2019.

Rumoured specifications surrounding the Snapdragon 845 include four ARM Cortex-A75 cores and four ARM Cortex-A53 cores to be paired with the Adreno 630 GPU for added graphical performance.

Compared to the Adreno 540, the Adreno 630 is expected to deliver significantly improved graphics performance. It is also expected to be optimised for AR, VR and XR (extended reality) that are now making their way to a lot of smartphones.

The X20 connectivity modem on the chipset will enable download speeds of up to 1.2 Gbps.

Also Read: India has seen assembly of mobile phones grow to 90% from zero: Qualcomm

The processor will also come with updated Kryo cores.

In line with the previous deal it had with the Snapdragon 835, Samsung this time too is reported to have reserved the first batch of SD845 processors for its Galaxy S9 and S9 Plus flagships.

Reports are also suggesting that the Xiaomi Mi 7 will be the first device to feature the Qualcomm Snapdragon 845. Moreover, Gizmochina reports that Xiaomi is in works with Qualcomm to optimise its chipset Snapdragon 845 v2 for Mi 7.

Qualcomm has also started working on its Snapdragon 855 chipset, which is said to be 7nm and will be manufactured in Taiwan. An announcement is expected around late 2018.

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